SC252008B Molded Power Inductor-Small size

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SC252008B Series Mini Molded Inductors (Produced by Fenfa Electronics) Technical Highlights:
- Wound with flat wire and hot-pressed into a single unit
- Custom-developed metal powder formulation for high performance
- Uniform spray coating, available in black and gray
Size Code 252008
L*W*H 2.5x2x0.8mm
Bonding Pad 2
sales@coilsfenfa.com;marketing@coilsfenfa.com
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Detail

|   SC252008B Molded Power Inductor Specification

On the mobile device, hold the table and swipe left or right to view the detailed parameters.



型号电感值直流电阻饱和电流温升电流下载
NumLDCRIsatIrmsDownload

( μH ) at 1MHz/1V( mΩ )( A )
( A )

±20%TYPMAXTYPMAXTYPMAX
SC252008B-R33M-R-S0.3317206.15.75.95.51.png
SC252008B-R47M-R-S0.47222765.3

6.5

61.png
SC252008B-R68M-R-S0.68273254.5

4.9

4.41.png
SC252008B-1R0M-R-S134404.54

4.3

41.png
SC252008B-1R5M-R-S1.564753.53

3.4

31.png
SC252008B-2R2M-R-S2.2697732.6

3

2.61.png
SC252008B-3R3M-R-S3.31501802.52.1

2.5

2.11.png
SC252008B-4R7M-R-S4.71601801.91.5

2

1.51.png
SC252008B-6R8M-R-S6.82603001.41.2

1.3

1.11.png
SC252008B-100M-R-S104905401.31.1

1.4

1.31.png


Package:3000pcs/r





|   SC252008B Molded Power Inductor Size


A:2.5±0.2 mmB:2±0.2 mm
C:0.8MAX mmD:0.8±0.2 mm
E:0.85±0.2 mmf:0.7typ mm
g:2.6typ mmh:2.1typ mm


1.jpg






|   SC252008B Molded Power Inductor Application

SC252008B Molded Power Inductor is Widely used in DC/DC converters, tablets, smart phones, portable gaming devices, smart wearables, Wi-Fi modules, laptops, VR, AR, LCD displays, HDDs, DVCs, DSCs, baseband power supplies, amplifiers, power management, module power supplies, camera power supplies, etc.