SC201606B Molded Power Inductor-Small size

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SC201606B Series Mini Molded Inductors (Produced by Fenfa Electronics) Technical Highlights:
- Wound with flat wire and hot-pressed into a single unit
- Custom-developed metal powder formulation for high performance
- Uniform spray coating, available in black and gray
Size Code 201606
L*W*H 2x1.6x0.65mm
Bonding Pad 2
sales@coilsfenfa.com;marketing@coilsfenfa.com
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Detail

|   SC201606B Molded Power Inductor Specification

On the mobile device, hold the table and swipe left or right to view the detailed parameters.


型号电感值直流电阻饱和电流温升电流下载
NumLDCRIsatIrmsDownload

( μH ) at 1MHz/1V( mΩ )( A )
( A )

±20%TYPMAXTYPMAXTYPMAX
SC201606B-R47M-R-S0.4733404.4454.51.png
SC201606B-R68M-R-S0.6842503.43.1

4

3.51.png
SC201606B-1R0M-R-S1587032.7

3.5

31.png
SC201606B-2R2M-R-S2.21451702.22

2.8

2.61.png
SC201606B-4R7M-R-S4.73654201.51.3

1.4

1.21.png
SC201606B-100M-R-S10100011500.90.8

0.8

0.7

1.png


Package:3000pcs/r





|   SC201606B Molded Power Inductor Size


A:2±0.2 mmB:1.6±0.2 mm
C:0.65MAX mmD:0.6±0.2 mm
E:0.7±0.2 mmf:0.5typ mm
g:2.1typ mmh:1.7typ mm


1.jpg






|   SC201606B Molded Power Inductor Application

SC201606B Molded Power Inductor is

Widely used in DC/DC converters, tablets, smart phones, portable gaming devices, smart wearables, Wi-Fi modules, laptops, VR, AR, LCD displays, HDDs, DVCs, DSCs, baseband power supplies, amplifiers, power management, module power supplies, camera power supplies, etc.