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SC201208B Molded Power Inductor-Small size

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SC201208B Series Mini Molded Inductors (Produced by Fenfa Electronics) Technical Highlights:
Flat wire winding with hot-press molding
Custom-developed metal powder formulation for high performance
Uniform spray coating, available in black and gray
Size Code 201208
L*W*H 2x1.2x0.8mm
Bonding Pad 2
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Detail

|   SC201208B Molded Power Inductor Specification

On the mobile device, hold the table and swipe left or right to view the detailed parameters.



型号电感值直流电阻饱和电流温升电流下载
NumLDCRIsatIrmsDownload

( μH ) at 1MHz/1V( mΩ )( A )
( A )

±20%TYPMAXTYPMAXTYPMAX
SC201208B-R11M-R-S0.1110129.5976.51.png
SC201208B-R15M-R-S0.1511137.57

6.8

6.31.png
SC201208B-R24M-R-S0.2415177.27

7

6.51.png
SC201208B-R33M-R-S0.33202465.4

5.8

5.21.png
SC201208B-R47M-R-S0.4724285.24.8

4.7

4.51.png
SC201208B-R68M-R-S0.6850604.23.7

3.7

3.31.png
SC201208B-1R0M-R-S1557043.5

3.3

2.91.png
SC201208B-1R5M-R-S1.511813532.5

2.2

1.91.png
SC201208B-2R2M-R-S2.21601852.62.3

2.2

1.81.png
SC201208B-3R3M-R-S3.32533001.91.6

1.8

1.51.png
SC201208B-4R7M-R-S4.72853251.61.4

1.7

1.51.png
SC201208B-6R8M-R-S6.84605301.31.1

1.1

11.png
SC201208B-100M-R-S107008000.90.8

0.8

0.71.png


Package：3000pcs/r




|   SC201208B Molded Power Inductor Size


A：2±0.2 mmB：1.2±0.2 mm
C：0.8MAX mmD：0.6±0.2 mm
E：0.7±0.2 mmf：0.5typ mm
g：2.1typ mmh：1.3typ mm


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|   SC201206B Molded Power Inductor Application

SC201206B Molded Power Inductor is

Widely used in DC/DC converters, tablets, smartphones, portable gaming devices, smart wearables, Wi-Fi modules, laptops, VR, AR, LCD displays, HDDs, DVCs, DSCs, baseband power supplies, amplifiers, power management, module power supplies, and camera power supplies.
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